ELECTRONIC APPLICATIONS
Powders For Electronic Applications
Current Markets
- Electronic and microelectronic packaging
- Thick film Conducting and Adhesive Pastes for low temperature and high temperature firing
- Capacitor Chips and Internal Electrodes in Passive Components
- Mobil Devices
○ Interconnects (blind and buried vias)
Our powders are RoHS compliant
Emerging Makets
- High Power Semi Conductors Applications
○ Conserving energy at low cost
○ Die-Attach between semi-conductor and its package - Printed Circuit Board fabrication (PCB’s)
○ low cost pcb’s for mobile devices like smartphones
○ Leadfree assembly materials for semi conductor packaging
○ High density flash memory chips for mobile devices - Semi Conductor Packaging
○ Power Semi-conductors/electronics
○ LED’s
○ Computer memory - Solder Replacement
○ Component attach
○ Solar Cells
○ Thermal interface - Electric Vehicles/Autonomous Vehicles
○ Control Chips analog and mixed signal power chips
○ Sensors, wireless communications. Interface chips and memory chips